Formation of stud bumps
We will accommodate various stud bump processing according to your specifications.
Stud bump processing is essential in flip chip mounting technology. Our company can form stud bumps even from a single wafer. We can also process two-tier bumps. We provide leveling support. We can accommodate wafer sizes up to a maximum of 12 inches. We support individual chips, bare wafers, tape-mounted wafers, and reconstructed wafers.
- Company：エスタカヤ電子工業
- Price：Other
